Method of manufacturing semiconductor device

ABSTRACT

A method of manufacturing a semiconductor device is disclosed. The method may comprise: forming a gate stack on a substrate; depositing a dielectric layer on the substrate and the gate stack; performing a main etching operation on the dielectric layer to form a spacer, with a remainder of the dielectric layer left on the substrate; and performing an over etching operation to remove the remainder of the dielectric layer. According to the method disclosed herein, two etching operations where an etching gas comprises a helium gas are performed, without forming an etching stop layer of silicon oxide. As a result, it is possible to reduce damages to the substrate and also to reduce the process complexity. Further, it is possible to optimize a threshold voltage, effectively reduce an EOT, and enhance a gate control capability and a driving current.

CROSS-REFERENCE TO RELATED APPLICATION(S)

The present application claims priority to Chinese Application No.201210229309.9, entitled “METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,”filed on Jul. 3, 2012, which is incorporated herein by reference in itsentirety.

TECHNICAL FIELD

The present disclosure relates to the field of manufacture ofsemiconductor integrated circuits, and particularly, to a method ofetching a spacer.

BACKGROUND

In manufacture of Large Scale Integrated Circuits, generally adielectric spacer is formed before a Light Doped Drain (LDD)implantation process, to prevent source/drain implantation at a greaterdose from being too close to a channel to cause source-drainpunch-through, which in turn results in device failure and a reducedyield.

Presently, a popular 65 nm node spacer or even a 45 nm node spacer canbe fabricated as follows. Before the LDD implantation process, a thinfilm layer of silicon oxide is deposited or thermally grown. Forexample, the layer of silicon oxide can be grown by means of RapidThermal Oxidation (RTO) to a thickness of about 30 Å, and then can serveas an etching stop layer for protecting a substrate, especiallyinterfaces of source/drain regions close to a channel region, fromdamages, to avoid increase of defect densities. Further, a wellconformal thin film layer of silicon nitride is deposited to surround apolysilicon gate. Finally, portions of the silicon nitride on thesubstrate and the gate can be removed away by means of plasma etching,which is stopped on the underlying oxide layer. As a result, the spaceris achieved.

On the other hand, as critical dimensions are continuously scaling downaccording to the Moore's Law, the conventional gate oxide/polysilicongate configuration is going further away from requirements of advancedlogic devices, and thus is being replaced gradually by the high K-metalgate configuration. Further, the gate last process is becoming adominant one because of its good control of thermal effects andthreshold voltages, but causes many new difficulties and challenges. Fora first spacer, if it is manufactured by the conventional process wherethe combination of silicon oxide and silicon nitride is adopted, thensilicon nitride will react with the high K dielectric, resulting in areduced K value and thus an increased Effective Oxide Thickness (EOT).Due to this, a gate control capability is degraded, and an on-off ratiois deteriorated. Further, the gate should have a reduced height, to copewith the challenge of filling the metal gate occurring in thedevelopment of the CMOS manufacture processes. To fill the metal in asolid manner, it is necessary to reduce a depth-to-width ratio of a gateline. Furthermore, due to continuous scaling of a gate pitch, thethickness of the first spacer is continuously decreasing. To preciselycontrol the repeatability, reliability, and stability of the etchingprocess, it is necessary to slow down an etching rate to fight withincreasingly stringent challenges of the etching process. This tends todeteriorate the uniformity of the etching rate of the spacer.Especially, current spacer etching techniques are generally based onAr-based gases, which tend to make damages to the substrate,particularly for nanometer-scale devices.

SUMMARY

In view of the above, the present disclosure aims to provide, amongothers, a novel method of etching a spacer, by which it is possible toreduce damages to a substrate, and also to reduce an EOT and enhance agate control capability and a driving current.

According to an aspect of the present disclosure, there is provided amethod of manufacturing a semiconductor device, comprising: forming agate stack on a substrate; depositing a dielectric layer on thesubstrate and the gate stack; performing a main etching operation on thedielectric layer to form a spacer, with a remainder of the dielectriclayer left on the substrate; and performing an over etching operation toremove the remainder of the dielectric layer.

In an example of the present disclosure, the gate stack may comprise agate oxide layer and a gate electrode layer. The gate oxide layer maycomprise any of silicon oxide, silicon nitroxide, and a high K material.The gate electrode layer may comprise any of polysilicon, amorphoussilicon, and a metal gate.

In a further example of the present disclosure, the dielectric layer maycomprise silicon nitride, and the depositing may comprise LPCVD orPECVD.

In a further example of the present disclosure, the main etchingoperation and/or the over etching operation may adopt etching gasesincluding a fluorine-based gas, an oxidizing gas and a helium-based gas.

In a further example of the present disclosure, the main etchingoperation may comprise adjusting an electrode power, a chamber pressure,and a ratio of flow rates of the reactive gases to enhance anisotropy soas to achieve the spacer with a steep profile.

In a further example of the present disclosure, the over etchingoperation may comprise adjusting an electrode power, a chamber pressure,and a ratio of flow rates of the reactive gases to achieve a greatetching selectivity of the dielectric layer with respect to thesubstrate.

In a further example of the present disclosure, the selectivity can begreater than 10:1.

In a further example of the present disclosure, the fluorine-based gasmay comprise a fluorocarbon gas or NF₃.

In a further example of the present disclosure, the fluorine-based gasfor the main etching operation may comprise CF₄, CHF₃, and CH₂F₂.

In a further example of the present disclosure, the fluorine-based gasfor the over etching operation may comprise CF₄, CH₃F, and CH₂F₂.

In a further example of the present disclosure, the oxidizing gas maycomprise O₂.

In a further example of the present disclosure, the helium-based gas maycomprise a helium gas, or a mixture of a helium gas and an argon gas.

In a further example of the present disclosure, the main etchingoperation can be stopped by an endpoint detection system which isautomatically triggered by a change in spectrum lines of reactants andresultants, and then the over etching operation is started.

In a further example of the present disclosure, the main etchingoperation can be performed for a time period required for the mainetching to proceed to the proximity to a surface of the substrate, whichis calculated based on an etching rate, and then the over etchingoperation is started.

In a further example of the present disclosure, the main etchingoperation and/or the over etching operation may be performed in anetcher based on a CCP or ICP mode.

In a further example of the present disclosure, the method may furthercomprise: implanting ions into the substrate, with the spacer as a mask,to form source and drain regions; removing the dummy gate stack to forma gate groove; and filling a gate dielectric layer comprising a high Kmaterial and a gate conductor layer comprising a metal material into,the gate groove, to form a high K-metal gate stack.

According to the method disclosed herein, two etching operations wherethe etching gas comprises the helium gas are performed, without formingan etching stop layer of silicon oxide. As a result, it is possible toreduce damages to the substrate and also to reduce the processcomplexity. Further, it is possible to optimize a threshold voltage,effectively reduce the EOT, and enhance the gate control capability andthe driving current.

BRIEF DESCRIPTION OF THE DRAWINGS

Hereinafter, exemplary embodiments of the present disclosure will bedescribed in detail with reference to attached drawings, in which

FIGS. 1-4 are cross-sectional views schematically showing a process ofmanufacturing a semiconductor device according to an embodiment of thepresent disclosure; and

FIG. 5 is a flow chart showing a method of manufacturing a semiconductordevice according to an embodiment of the present disclosure.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure will bedescribed in detail with reference to attached drawings. It is to benoted that like symbols denote like structures throughout the drawings.Here, terms, such as “first,” “second,” “on,” “below,” “thick,” and“thin,” are used to describe various device structures. However, suchdescriptions are not intended to imply relationships of the describeddevice structures in terms of space, order or layer-level, unlessotherwise indicated.

Referring to FIG. 5 and FIG. 1, at S501, a gate stack is formed on asubstrate. The gate stack can be one for a gate first process or for agate last process. The substrate 1 is provided, and may comprise bulkSi, SOI, bulk Ge, GeOI, SiGe, GeSb, or a group III-V or group II-VIcompound semiconductor substrate, such as GaAs, GaN, InP, and InSb. Tobe compatible with the existing CMOS processes and applicable tomanufacture of large scale digital integrated circuits, the substrate 1preferably comprises bulk Si or SOI. A relatively thin gate oxide layer2 is formed on the substrate 1 by means of deposition, such as LPCVD,PECVD, and thermal oxidation. The gate oxide layer 2 may comprise Si0 ₂with a thickness of about 1-5 nm, for example, for protecting thesubstrate when removing a dummy gate later in the gate last process. Adummy gate layer 3 is formed on the gate oxide layer 2 by means ofLPCVD, a diffusion furnace, or the like. The dummy gate layer 3 maycomprise polysilicon or amorphous silicon, for example. Then, the dummygate layer 3 (and preferably also the gate oxide layer 2) is patternedby a photolithography/etching process, to form a dummy gate stack. Theetching process may comprise plasma etching (with inert ions such asAr), Reactive Ion Etching (RIE, with a fluorine-based gas), oranisotropic wet etching (with a TMAH solution for etching Si, and aHF-based solution for etching SiO₂). The etching can be stopped on aninterface between the gate oxide layer 2 and the dummy gate layer 3.Alternatively, the etching can be done overly to some extent to exposethe substrate 1. The pattern of the dummy gate stack 2/3 is not limitedto a single line as shown in FIG. 1, but can comprise a plurality ofparallel lines or lines intersecting each other locally according to alayout design, which are located at gate positions of MOSFETs to beformed later. Side walls of the dummy gate stack are substantiallysteep. That is, the dummy gate stack forms an angle of about 90 degrees(for example, within ±2.5° about 90°) with respect to the substrate.

Referring to FIG. 5 and FIG. 2, at S502, a dielectric layer is depositedon the dummy gate stack. If the gate oxide layer 2 has not been etchedin the process of FIG. 1, portions of the gate oxide layer 2 outside thedummy gate stack can be removed by HF-based wet etching, preferably.Then, a dielectric layer 4 with a uniform thickness is deposited on theentire substrate (or wafer) by a conventional deposition process, suchas LPCVD and PECVD. The dielectric layer 4 may comprise a material whichis relatively hard and has a relatively great etching selectivity withrespect to materials of the previously formed layers, such as siliconnitride, silicon nitroxide, and diamond-like amorphous carbon. Thedielectric layer 4 can serve as not only an insulating isolation for theside walls of the gate, but also a stress supply to a channel region forenhancement of a driving capability. Preferably, the dielectric layer 4comprises a thin film of silicon nitride deposited by PECVD. Thedielectric layer 4 is conformal with the dummy gate stack as shown inFIG. 2. The technology disclosed herein differs from the conventionalone in that, among others, there is no oxide layer between thedielectric layer 4 and the dummy gate stack. As a result, it is possiblenot to increase an EOT in the gate last process, and thus prevent thedriving capability from being degraded. The dielectric layer 4 may havea thickness of about 20-40 nm, for example.

Referring to FIG. 5 and FIG. 3, at S503, a main etching operation isperformed to anisotropically etch the dielectric layer so as to form aspacer 4A. For example, an etching equipment, adopting a plasma etchingsystem and based on a CCP or ICP mode, can be used. It is possible toadjust an electrode power, a chamber pressure, and a ratio of flow ratesof reactive gases, to enhance the anisotropy so that portions of thedielectric layer on top of the dummy gate stack is completely removed,while portions thereof on the side walls of the dummy gate stack issubstantially remained to constitute the spacer 4A. There may be someremainder 4B of the dielectric layer on a surface of the substrate in anactive region. An etching gas adopted in the etching operation maycomprise a fluorine-based gas, such as a fluorocarbon gas.Alternatively, other gases such as NF₃ and SF₆ are also feasible. Toachieve a steep etching profile, it is necessary to optimize a ratio ofradicals to ions in the fluorocarbon gas and to adjust an amount ofpolymers. According to an embodiment, the fluorocarbon gas may compriseCF₄, CHF₃, CH₃F, and CH₂F₂. Preferably, it is possible to remove thepolymers by means of an oxidizing gas such as O₂ and CO. According to anexample, the etching gas adopted in the main etching operation comprisesa combination of CF₄ and CHF₃, a combination of CF₄ and CH₂F₂, or onlyCHF₃, and the oxidizing gas comprises O₂.

Further, to precisely control the repeatability, reliability, andstability of the etching process, it is necessary to slow down anetching rate thereof. In the prior art generally Ar is added as adiluent agent to slow down the etching rate. However, Ar has a greatatomic weight and a great momentum, and thus imparts significantbombardment to the substrate. This tends to damage the underlyingmaterials for nanometer-scale devices. Especially when the liner layerof silicon oxide for the polysilicon gate is very thin, it is easy foroxygen plasma to penetrate through the thin oxide layer to react withthe substrate, resulting in a great silicon loss. Therefore, accordingto an embodiment of the present disclosure, the etching gas comprises ahelium-based gas, such as a helium gas and a mixture of a helium gas andan argon gas, in addition to the fluorine-based gas which is the mainconstituent (and/or the oxidizing gas). In his way, it is possible tosignificantly reduce damages to the substrate. Further, it is difficultto achieve stable plasma by means of only the helium gas because of itssmall atomic weight and small collision cross section. Preferably, themixture of the helium gas and the argon gas can be used, so that it ispossible to achieve plasma dispersed more uniformly in the chamber, andthus to improve the etching uniformity. In other words, the helium-basedgas preferably comprises the mixture of the helium gas and the argongas.

When the etching proceeds to the surface of the underlying substrate 1,an endpoint detection system can be triggered automatically by a changein spectrum lines of the reactants and resultants, to stop the mainetching operation. Then, the process quickly transits to an over etchingoperation. Alternatively, a time period for the main etching operationcan be calculated based on the etching rate, so that the main etchingproceeds to the proximity to the substrate surface, to achieve a steepprofile without footing. After that time period, the over etchingoperation begins. The spacer 4A has a width almost equal to or reducedby less than 10% with respect to the thickness of the originaldielectric layer 4. Specifically, the width may be 20-40 nm. Theremainder 4B of the dielectric layer left on the surface of thesubstrate 1 has a thickness much less than that of the originaldielectric layer 4. For example, the thickness of the remainder 4B isless than 20% of the original thickness, and may be 3-5 nm. The spacer4A is substantially steep, that is, forms an angle of about 90 degreeswith respect to the substrate 1. Particularly, at joints between thespacer 4A and the substrate 1, there is substantially or completely noremainder of the dielectric layer 4 left at corners due to selection ofetching stop condition(s). That is, the dielectric layer has a thicknessof about 0 locally at the corners.

Referring to FIG. 5 and FIG. 4, at S504, the over etching operation iscarried out to remove the remainder of the dielectric layer.Specifically, it is necessary to remove the remainder 4B of thedielectric layer over the entire wafer after the spacer 4A with thesteep profile is achieved by means of the main etching operation.Because the deposited dielectric layer 4 may have its thickness variedacross the wafer, it is necessary to add some over etching. To reducedamages to the substrate, it is desired that the dielectric layer 4 hasa relatively great etching selectivity with respect to the substrate 1,for improvement of device performances. For example, an etchingequipment, adopting a plasma etching system and based on a CCP or ICPmode, can be used. The selectivity of the dielectric layer 4 (e.g.,silicon nitride) with respect to the silicon substrate depends mainly onflow rates of the reactive gases and also a ratio thereof. Similarly tothe main etching operation as shown in FIG. 3, the over etchingoperation shown in FIG. 4 mainly adopts a fluorine-based gas (e.g.,fluohydrocarbon, preferably CF₄, CH₂F₂, and CH₃F, as described inconjunction with FIG. 3) and also an oxidizing gas (preferably, O₂, asdescribed above) and a helium-based gas (serving as a diluent agent). Agreat selectivity above 10:1 (or preferably, even above 15:1) can beachieved by adjusting an electrode power, a chamber pressure, and aratio of flow rates of the reactive gases, so as to make less damages tothe substrate. According to an example, the etching gas adopted in theover etching operation may comprise a combination of CF₄ and CH₃F, acombination of CF₄ and CH₂F₂, or only CH₃F, and the oxidizing gas maycomprise O₂. Some more over etching can be added (as needed) accordingto load conditions.

There are various etchers from different manufacturers. They may havedifferent chamber designs, but can be based on the same principle. Here,a case where an Exelan Hpt etcher from LAM is used is exemplified.Recommended parameters for the main etching operation and the overetching operation as described above are shown in Table 1.

TABLE 1 Pressure/ CHF₃/ CH₃F/ Conditions mtorr HF/W LF/W CF₄ /sccm sccmsccm O₂/sccm Ar/sccm He/sccm Main 100-150 100-300 0-200 3-20 15-30 5-25200-800 400-1200 Etching Over 100-200 100-300 0-100 3-10 10-50 10-100200-800 400-1200 Etching

Here, HF and LF indicate a higher frequency power and a lower frequencypower, respectively. Table 1 exemplifies some specific etching gases andparameters. It is to be understood that other gases such as thosedescribed above are also feasible and that the parameters can bereasonably adjusted, provided that the over etching operation canachieve a sufficiently great selectivity (e.g., above 15:1).

As a result, the spacer is achieved. After that, the process can proceedas in the gate last process. Specifically, source/drain ion implantationcan be carried out with the spacer as a mask, to form source and drainregions. Metal silicide may be formed on/in the source and drain regionsto reduce a resistance of the source and drain. An interlayer dielectriclayer can be deposited on the entire wafer. The dummy gate stack can beremoved by means of dry or wet etching, resulting in a gate groove, intowhich a gate dielectric layer comprising a high K material and a gateconductor layer comprising a metal material can be depositedsequentially. Then, the interlayer dielectric layer can be etched untilthe source and drain regions and/or the metal silicide are exposed toform source/drain contact holes, into which a metal material can befilled by deposition to form source/drain contact plugs.

According to the method disclosed herein, two etching operations wherethe etching gas comprises the helium gas are performed, without formingan etching stop layer of silicon oxide. As a result, it is possible toreduce damages to the substrate and also to reduce the processcomplexity. Further, it is possible to optimize a threshold voltage,effectively reduce the EOT, and enhance a gate control capability and adriving current.

From the foregoing, it will be appreciated that specific embodiments ofthe disclosure have been described herein for purposes of illustration,but that various modifications may be made without deviating from thedisclosure. In addition, many of the elements of one embodiment may becombined with other embodiments in addition to or in lieu of theelements of the other embodiments. Accordingly, the technology is notlimited except as by the appended claims.

I/We claim:
 1. A method of manufacturing a semiconductor device,comprising: forming a gate stack on a substrate; depositing a dielectriclayer on the substrate and the gate stack; performing a main etchingoperation on the dielectric layer to form a spacer, with a remainder ofthe dielectric layer left on the substrate; and performing an overetching operation to remove the remainder of the dielectric layer. 2.The method according to claim 1, wherein the gate stack comprises a gateoxide layer and a gate electrode layer, wherein the gate oxide layercomprises any of silicon oxide, silicon nitroxide, and a high Kmaterial, and the gate electrode layer comprises any of polysilicon,amorphous silicon, and a metal gate.
 3. The method according to claim 1,wherein the dielectric layer comprises silicon nitride, and thedepositing comprises LPCVD or PECVD.
 4. The method according to claim 1,wherein the main etching operation and/or the over etching operationadopts etching gases including a fluorine-based gas, an oxidizing gasand a helium-based gas.
 5. The method according to claim 4, wherein themain etching operation comprises adjusting an electrode power, a chamberpressure, and a ratio of flow rates of the reactive gases to enhanceanisotropy so as to achieve the spacer with a steep profile.
 6. Themethod according to claim 4, wherein the over etching operationcomprises adjusting an electrode power, a chamber pressure, and a ratioof flow rates of the reactive gases to achieve a great etchingselectivity of the dielectric layer with respect to the substrate. 7.The method according to claim 6, wherein the etching selectivity isgreater than 10:1.
 8. The method according to claim 4, wherein thefluorine-based gas comprises a fluorocarbon gas or NF₃.
 9. The methodaccording to claim 8, wherein the fluorine-based gas for the mainetching operation comprises CF₄, CHF₃, and CH₂F₂.
 10. The methodaccording to claim 8, wherein the fluorine-based gas for the overetching operation comprises CF₄, CH₃F, and CH₂F₂.
 11. The methodaccording to claim 4, wherein the oxidizing gas comprises O₂.
 12. Themethod according to claim 4, wherein the helium-based gas comprises ahelium gas, or a mixture of a helium gas and an argon gas.
 13. Themethod according to claim 1, wherein the main etching operation isstopped by an endpoint detection system which is triggered by a changein spectrum lines of reactants and resultants, and then the over etchingoperation is started.
 14. The method according to claim 1, wherein themain etching operation is performed for a time period required for themain etching to proceed to the proximity to a surface of the substrate,which is calculated based on an etching rate, and then the over etchingoperation is started.
 15. The method according to claim 1, wherein themain etching operation and/or the over etching operation is performed inan etcher based on a CCP or ICP mode.
 16. The method according to claim1, further comprising: implanting ions into the substrate, with thespacer as a mask, to form source and drain regions; removing the dummygate stack to form a gate groove; and filling a gate dielectric layercomprising a high K material and a gate conductor layer comprising ametal material into the gate groove, to form a high K-metal gate stack.